WL HT007 Motherboard Heating Platform For iPhone X-11/12/13/14/15 16PM PCB Board Middle Frame Layered Desoldering Rework Station
The WL HT007 Motherboard Heating Platform is a professional PCB desoldering and rework station designed for iPhone X to 16PM. It supports middle frame separation, layered heating, and safe removal of IC components. Ideal for high-precision mobile repair tasks.
Original price was: ₹14,999.0.₹11,499.0Current price is: ₹11,499.0.
(Save ₹3,500.0)Description
WL HT007 Motherboard Heating Platform For iPhone X-11/12/13/14/15 16PM PCB Board Desoldering Rework Station
The WL HT007 Motherboard Heating Platform is a professional-grade tool engineered for high-precision mobile repair tasks. Compatible with iPhone X to iPhone 16 Pro Max, this advanced PCB board heating station ensures safe and efficient desoldering of motherboard components using layered and controlled heating. Ideal for technicians working on sensitive logic boards and IC chips.

🔧 Key Features
- Supports iPhone X to 16PM motherboard models
- Layered heating for secure frame and IC removal
- Precision thermostat control to prevent overheating
- Aluminum alloy body for durability and heat resistance
- Ideal for professional repair shops handling baseband, NAND, and Face ID repairs
📦 Technical Specifications
Brand | WL |
Model | HT007 |
Compatible Devices | iPhone X to 16PM Motherboards |
Temperature Control | Adjustable Precision Thermostat |
Material | Aluminum Alloy |
🛠️ Applications
This tool is perfect for:
- Motherboard desoldering and reballing
- Face ID and IC chip removal
- Middle frame separation and heating repairs
📸 Product Gallery









Note: This is a physical product. No refund policy applicable once sold.
Specifications
- BrandWL
- ModelHT007
- Compatible DevicesiPhone X to 16PM Motherboards
- Temperature ControlAdjustable Precision Thermostat
- MaterialAluminum Alloy
Additional information
Weight | .360 kg |
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