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MIJING Z21 MAX CPU IC CHIP REBALLING STENCIL STATION FOR IPHONE ANDROID
Applicable Model:
- For iPhone 6-14 Pro Max CPU (A8 A9 A10 A11 A12 A13 A14 A15 A16 CPU).
- For Huawei HI3670, Huawei HI3680, HiSilicon HI3690, HiSilicon HI3690 5G, HiSilicon HI6290/L, Qualcomm SM8250-102 small, Qualcomm SM8250-202 large, Qualcomm SM8350/Snapdragon 888, Snapdragon 845/SDM845, Snapdragon 855/SM8150, Kirin 9000 HI36A0, EMMC/EMCP/UFS BGA153.
QC-20 BGA-IC Glue Remover
Product Feature:
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.
- It won't do harm to your circuit board and components. Environment friendly and safe.
- Doesn't contain any Benzene Coderivative substances with cause leukaemia. Convenient to use
Mijing Z21 IC CPU BGA Reballing Fixture for A8 A9 A10 A11 A12 A13 A14 A14S A15 Repair Kit with Stencil
MIJING Z21 10 in 1 Middle Layer Planting Tin Platform For iPhone 6-12mini/12 Pro Max 13 Motherboard Positioning Chip BGA Planting Tin
Usage Steps
01 : Place the chip in the positioning area (place it according to the direction indicated by the positioning area/stencil )
02 : Select the suitable tin planting net and place it according to the direction of the chip
03 : Check the alignment of the tin planting net and the chip tin position (the steel net has a special limit)
04 : Use a solder scraper to evenly fill the tin paste area to be planted
05 : Use an air gun to blow tin into a ball above the stencil(tweezers can be used to assist)
MiJing Z20 BGA Reballing Fixture 10in1 Tool Set
MiJing Z20 BGA Reballing Fixture 10in1 Tool Stencil Platform Jig Fixture is professional BGA Reballing Stencil Fixture for iPhone X-12/12pro, iPhone X-12/12pro motherboard BGA reballing fixture tool, is used for positioning and reballing iPhone X- 12/12pro PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for iPhone X-12/12 pro BGA reballing and repairing.
