MIJING Z21 MAX CPU IC CHIP REBALLING STENCIL STATION FOR IPHONE ANDROID
Applicable Model:
- For iPhone 6-14 Pro Max CPU (A8 A9 A10 A11 A12 A13 A14 A15 A16 CPU).
- For Huawei HI3670, Huawei HI3680, HiSilicon HI3690, HiSilicon HI3690 5G, HiSilicon HI6290/L, Qualcomm SM8250-102 small, Qualcomm SM8250-202 large, Qualcomm SM8350/Snapdragon 888, Snapdragon 845/SDM845, Snapdragon 855/SM8150, Kirin 9000 HI36A0, EMMC/EMCP/UFS BGA153.
MiJing Z20 BGA Reballing Fixture 10in1 Tool Set
MiJing Z20 BGA Reballing Fixture 10in1 Tool Stencil Platform Jig Fixture is professional BGA Reballing Stencil Fixture for iPhone X-12/12pro, iPhone X-12/12pro motherboard BGA reballing fixture tool, is used for positioning and reballing iPhone X- 12/12pro PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for iPhone X-12/12 pro BGA reballing and repairing.